*Base Material FR-4, CEM-1, CEM-3, high TG, FR4 halogen free, rogers
*Number of Layers 1~28 Layer
*Board Thickness 0.21 to 7.0mm
*Copper Thickness 0.5 OZ to 7.0 OZ
*Min. Hole Size 3mil (0.075mm)
*Min. Line Spacing 3mil (0.075mm)
*Min. Line Width 3mil (0.075mm)
*Surface Finishing HASL/HASL lead free, HAL, chemical tin, chemical gold, immersion silver/gold, OSP, gold plating
*Solder Mask Color Green, Red, White,Yellow, Black, Blue, Customized